INVENIAINVENIA

Technology

Unrivaled expertise in large-area display dry etching equipment

INVENIA was the first Korean company to localize the dry etcher, one of the four core front-end systems in display manufacturing.

Plasma etching technology for large-area processes

Building on Korea’s first domestically developed dry etcher and proven G10.5 mass production, we have advanced large-area display etching technology. Our customized equipment designs use ECCP/ICP plasma and zone control technologies to support diverse LCD and OLED array process applications.

  • Large-Area Uniformity

    Uniform coverage across extra-large substrates
    Plasma delivery and zone control

  • Precise Plasma Control

    Based on specialized RF equipment design
    ECCP/ICP plasma control and fine circuit pattern etching

  • Modular Design

    Designed for ease of maintenance
    Modular architecture

  • Process Flexibility

    From general LCD/OLED array etching
    to advanced etching applications

R&D Achievements and Intellectual Property

INVENIA invests continuously in R&D to advance core technologies and strengthen its technological competitiveness.

Patents on proprietary plasma equipment design technologies
56
Patents on vacuum bonding, inspection and deposition equipment
15

Key R&D Projects

Vision Board Development
Equipped with camera image recognition and processing algorithms
Dry Etcher Development (PE Type)
Development of a proprietary large-area dry etcher model
Atmospheric Plasma Electrode Development
Replacing costly vacuum processes with low-cost, high-efficiency atmospheric processes
Plasma Ion Implantation for Semiconductors
Expansion into semiconductor equipment manufacturing
Dual-Mode Dry Etcher Development
Supporting diverse processes with fewer masks
Molten Solder Bump Manufacturing Template
Development of ultraprecise, low-vibration technology
ICP Dry Etcher Development
Securing domestic and overseas orders following LTPS equipment localization
Photo Inline TFT Pattern Inspection System
RTR module development and entry into the photo inline inspection market
OLED Hot-Press Bonding Equipment Development
Hot-press bonding equipment for OLED encapsulation
LCD RTR Module Development for G8 and Above
Core technology development for G8 and above LCD front-end process equipment
M2 Ph1 G8 Hot-Press Bonding System
Joint development of the M2 Ph1 G8 hot-press bonding system
AMOLED GRAPHENE SHEET
Joint research on new material processes for flexible displays
Core Technology Development for G10 High-Density Plasma Dry Etching Equipment
Development and commercialization of high-density plasma dry etching equipment; acquisition of G10 core process technologies
G8 OLED Rechargeable Source Development
Development of a G8 deposition system with rechargeable pixel materials
Localization of the G10.5 ICP Dry Etcher
Development of G10.5 inductively coupled plasma equipment