EN
Plasma Treatment
High-efficiency surface treatment solutions that optimize pre-deposition processes for OLED thin films
Our ECCP/ICP surface pretreatment technology for large-area (G8.5) OLED substrates precisely controls the contact angle across the entire substrate to 5° or less, maximizing organic material deposition efficiency and providing a wide process window while minimizing particles in mass production.
Plasma Treatment
- Vacuum: P/C ≤ 5.0 × 10⁻⁵ Torr
- E/R : ≤ 500Å/min (Low Power)
- Unif.(%) : ≤ 15%
